具實用性及交期導向之IC封裝廠排程演算法則之設計與應用

標題:	具實用性及交期導向之IC封裝廠排程演算法則之設計與應用 The Design and Application of the Algorithms with Practicability and Due-Date Orientation for Solving the IC Packaging Scheduling Problem (ICPSP)
作者:	彭文理 WEN LEAPEARN 國立交通大學工業工程與管理學系
關鍵字:	IC封裝;排程;演算法;交期指定;實用性;IC packaging;Scheduling;Algorithm;Due date assignment;Practicability
公開日期:	2001
官方說明文件#:	NSC90-2218-E009-019
URI:	http://hdl.handle.net/11536/93590 https://www.grb.gov.tw/search/planDetail?id=674285&docId=128524
Appears in Collections:	Research Plans

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