| 標題: | 高密度多層構裝基板與接合材料研究---子計畫II：銅接合-低介電材料介電層之界面可靠度提昇研究(III) Reliability Enhancement for Copper Interconnect-Low K Dielectric Interface (III) |
| 作者: | 邱碧秀 CHIOU BI-SHIOU 國立交通大學電子工程學系 |
| 關鍵字: | 多層基板;低介電材料;界面可靠度;高密度;銅互接;Multilayer substrate;Low dielectric material;Interfacial reliability;High density;Copper interconnection |
| 公開日期: | 2001 |
| 官方說明文件#: | NSC90-2216-E009-032 |
| URI: | http://hdl.handle.net/11536/93855 https://www.grb.gov.tw/search/planDetail?id=673263&docId=128265 |
| Appears in Collections: | Research Plans |
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