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Title: <111>奈米雙晶銅墊層之銲錫接點的電遷移及界面冶金反應研究
Electromigration and Metallurgical Reactions in Solder Joints with ≪111≫-Oriented Nanotwinned Cu Metallization
Authors: 陳智
Chen Chih
國立交通大學材料科學與工程學系（所）
Issue Date: 2013
Gov't Doc #: NSC102-2221-E009-040-MY3
URI: http://hdl.handle.net/11536/95271
https://www.grb.gov.tw/search/planDetail?id=3087570&docId=415367
Appears in Collections:Research Plans


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