完整後設資料紀錄
DC 欄位語言
dc.contributor.author郭正次en_US
dc.contributor.authorKUO CHENG-TZUen_US
dc.date.accessioned2014-12-13T10:39:12Z-
dc.date.available2014-12-13T10:39:12Z-
dc.date.issued1996en_US
dc.identifier.govdocNSC85-2216-E009-010zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/96199-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=206853&docId=36545en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject選擇性沈積zh_TW
dc.subject選擇性蝕刻zh_TW
dc.subject微細加工zh_TW
dc.subject薄膜zh_TW
dc.subjectSelective depositionen_US
dc.subjectSelective etchingen_US
dc.subjectMicromachiningen_US
dc.subjectThin filmen_US
dc.title導電薄膜之雷射微細加工技術研發zh_TW
dc.titleLaser Micromachining of the Conduction Filmsen_US
dc.typePlanen_US
dc.contributor.department國立交通大學材料科學工程研究所zh_TW
顯示於類別:研究計畫