標題: 高性混合訊號式發收機積體電路---子計畫I:互補式金氧半射頻發收機前置電路模組設計IP建立及應用研究(III)
The Design of CMOS Front-end IC Modules and IP Cores for RF Transceivers in Various Applications(III)
作者: 吳重雨
CHUNG-YUWU
交通大學電子工程系
關鍵字: 電路設計;射頻收發機;互補式金氧半導體;Circuit design;RF transceiver;CMOS
公開日期: 2001
官方說明文件#: NSC90-2215-E009-108
URI: http://hdl.handle.net/11536/96509
https://www.grb.gov.tw/search/planDetail?id=665814&docId=126402
Appears in Collections:Research Plans


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