標題: | 高性混合訊號式發收機積體電路---子計畫I:互補式金氧半射頻發收機前置電路模組設計IP建立及應用研究(III) The Design of CMOS Front-end IC Modules and IP Cores for RF Transceivers in Various Applications(III) |
作者: | 吳重雨 CHUNG-YUWU 交通大學電子工程系 |
關鍵字: | 電路設計;射頻收發機;互補式金氧半導體;Circuit design;RF transceiver;CMOS |
公開日期: | 2001 |
官方說明文件#: | NSC90-2215-E009-108 |
URI: | http://hdl.handle.net/11536/96509 https://www.grb.gov.tw/search/planDetail?id=665814&docId=126402 |
Appears in Collections: | Research Plans |
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