| 標題: | 高密度多層構裝基板與接合材料研究---總計畫(III) A Study on High Density Multilayer Substrate and Interconnection Materials (III) |
| 作者: | 邱碧秀 CHIOU BI-SHIOU 國立交通大學電子工程學系 |
| 關鍵字: | 高密度;多層基板;內接合材料;High density;Multilayer substrate;Interconection material |
| 公開日期: | 2001 |
| 官方說明文件#: | NSC90-2216-E009-031 |
| URI: | http://hdl.handle.net/11536/96608 https://www.grb.gov.tw/search/planDetail?id=673257&docId=128264 |
| Appears in Collections: | Research Plans |
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