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dc.contributor.authorChen, Yung-Yuen_US
dc.contributor.authorFu, Wen-Yuen_US
dc.contributor.authorYeh, Ching-Faen_US
dc.date.accessioned2014-12-08T15:12:55Z-
dc.date.available2014-12-08T15:12:55Z-
dc.date.issued2008-01-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2007.911977en_US
dc.identifier.urihttp://hdl.handle.net/11536/9971-
dc.description.abstractIn this letter, the electrical properties of a HfAlON dielectric with UV-O-3 interfacial oxide were comprehensively studied and then compared with those of a HfAlON dielectric with interfacial chemical oxide. In the comparison of dielectric characteristics including leakage current density, transconductance, subthreshold swing, saturation drain current, effective electron mobility, and constant voltage stress reliabilities, the results clearly indicate that high-density interfacial UV-O-3 oxide is beneficial in reducing both bulk and interface traps as well as diminishing stress-induced trap generation, and possesses a high potential to be integrated with further high-k. dielectric applications.en_US
dc.language.isoen_USen_US
dc.subjectHfAlONen_US
dc.subjecthigh-k dielectricen_US
dc.subjectozone oxideen_US
dc.titleElectrical characteristics of the HfAlON gate dielectric with interfacial UV-ozone oxideen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2007.911977en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume29en_US
dc.citation.issue1en_US
dc.citation.spage60en_US
dc.citation.epage62en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000252098100018-
dc.citation.woscount2-
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