瀏覽 的方式: 作者 Chang Edward Yi

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公開日期標題作者
27-五月-2014Current limit circuit apparatusChen Tsung-Lin; Chang Edward Yi; Chieng Wei-Hua; Cheng Stone; Jeng Shyr-Long; Huang Shin-Wei
1-五月-2012High electron mobility transistor and method for fabricating the sameChang Edward Yi; Kuo Chien-I; Hsu Heng-Tung
30-六月-2011High Electron Mobility Transistor and Method for Fabricating the SameChang Edward Yi; Kuo Chien-I; Hsu Heng-Tung
12-十一月-2013High-side driver circuitChen Tsung-Lin; Chang Edward Yi; Chieng Wei-Hua; Cheng Stone; Jeng Shyr-Long; Chang Che-Wei
27-八月-2013III-V metal-oxide-semiconductor deviceChang Edward Yi; Lin Yueh-Chin
11-十月-2011Method for forming a GexSi1-x buffer layer of solar-energy battery on a silicon waferChang Edward Yi; Tang Shih-Hsuan; Lin Yue-Cin
7-五月-2013Method for forming T-shaped gate structureChang Edward Yi; Huang Lu-Che; Chang Chia-Hua; Lin Yueh-Chin; Chieng Wei-Hua; Liu Shih-Chien
6-十月-2011Method for reducing defects in epitaxially grown on the group III-nitride materialsChang Edward Yi; Wong Yuen Yee
11-九月-2012Multilayer substrate having gallium nitride layer and method for forming the sameChang Edward Yi; Hsiao Yu-Lin; Lu Jung-Chi
17-九月-2013Multilayer substrate having gallium nitride layer and method for forming the sameChang Edward Yi; Hsiao Yu-Lin; Lu Jung-Chi
26-四月-2012MULTILAYER SUBSTRATE HAVING GALLIUM NITRIDE LAYER AND METHOD FOR FORMING THE SAMEChang Edward Yi; Hsiao Yu-Lin; Lu Jung-Chi
29-十一月-2012MULTILAYER SUBSTRATE HAVING GALLIUM NITRIDE LAYER AND METHOD FOR FORMING THE SAMEChang Edward Yi; Hsiao Yu-Lin; Lu Jung-Chi
23-六月-2011Sub-wavelength structure layer, method for fabricating the same and photoelectric conversion device applying the sameChang Edward Yi; Sahoo Kartika Chandra; Lin Men-Ku; Lu Yi-Yao; Wang Sheng-Ping
27-五月-2014Sun-chasing deviceSie You-Long; Chang Edward Yi; Jeng Shyr-Long; Chieng Wei-Hua; Lue Bin-Han; Peng Ming-Tsan; Chang Chia-Hua; Hu Jwu-Shen; Chiang Chien-Hsun
2007TFT-LCD 廠離子植入機機台維修保養危害風險分析及資料庫建置與應用研究翁寶玉; YU PO WENG; 張翼; Chang Edward Yi; 工學院產業安全與防災學程
10-五月-2011Vertical transmission line structure that includes bump elements for flip-chip mountingChang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han
1-五月-2012Vertical transmission line structure that includes bump elements for flip-chip mountingChang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han