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公開日期標題作者
1-二月-2010Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging ApplicationsHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-八月-2010Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent ReliabilityHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2012Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHzHsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2008Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigrationLiang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2008Effect of polyethylene glycol additives on pulse electroplating of SnAg solderChen, Hsiao-Yun; Chen, Chih; Wu, Pu-Wei; Shieh, Jia-Min; Cheng, Shing-Song; Hensen, Karl; 材料科學與工程學系; Department of Materials Science and Engineering
15-六月-2013Enhanced Luminous Efficiency of WLEDs Using a Dual-Layer Structure of the Remote Phosphor PackageChen, Kuo-Ju; Chen, Hsin-Chu; Shih, Min-Hsiung; Wang, Chao-Hsun; Tsai, Hsin-Han; Chien, Shih-Hsuan; Lin, Chien Chung; Kuo, Hao-Chung; 光電工程學系; Department of Photonics
1-一月-1999Fabrication and study of a shallow-gap Pirani vacuum sensor with a linearly measurable atmospheric pressure rangeChou, BCS; Chen, CN; Shie, JS; 光電工程學系; Department of Photonics
1-一月-1999Fabrication and study of a shallow-gap Pirani vacuum sensor with a linearly measurable atmospheric pressure rangeChou, BCS; Chen, CN; Shie, JS; 光電工程研究所; Institute of EO Enginerring
1-十月-2013Improving the Angular Color Uniformity of Hybrid Phosphor Structures in White Light-Emitting DiodesChen, Kuo-Ju; Han, Hau-Vei; Lin, Bing-Cheng; Chen, Hsin-Chu; Shih, Min-Hsiung; Chien, Shih-Hsuan; Wang, Kuan Yu; Tsai, Hsin-Han; Yu, Peichen; Lee, Po-Tsung; Lin, Chien-Chung; Kuo, Hao-Chung; 光電工程學系; Department of Photonics
2015INTEGRATED CMOS MEMS LIQUID CAPACITIVE INCLINOMETERChiu, Yi; Chen, Bo-Ting; Hong, Hao-Chao; 電機學院; College of Electrical and Computer Engineering
1-七月-2008Lifetime improvement of organic light emitting diodes using LiF thin film and UV glue encapsulationHuang, Jian-Ji; Su, Yan-Kuin; Chang, Ming-Hua; Hsieh, Tsung-Eong; Huang, Bohr-Ran; Wang, Shun-Hsi; Chen, Wen-Ray; Tsai, Yu-Sheng; Hsieh, Huai-En; Liu, Mark O.; Juang, Fuh-Shyang; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-1998A simple passive-alignment packaging technique for laser diode modulesWang, SC; Chi, S; Cheng, WH; 光電工程學系; Department of Photonics
1-十月-1998A simple passive-alignment packaging technique for laser diode modulesWang, SC; Chi, S; Cheng, WH; 光電工程研究所; Institute of EO Enginerring
1-八月-2006Study of electromigration in eutectic SnPb solder stripes using the edge displacement methodChou, C. K.; Hsu, Y. C.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2012以直流電製備奈米雙晶銅及其在3D IC 封裝之應用劉道奇; Liu, Tao-Chi; 陳智; Chen, Chih; 材料科學與工程學系
1998兩岸半導體產業合作可行性分析陳鉅盛; Chen Chu sheng; 袁建中; Benjamin Yuan; 科技管理研究所
2001共晶錫鉛銲錫之氣密式封裝之技術研究黃子瑜; Annie Tzu-yu Huang; 陳 智; Chih Chen; 材料科學與工程學系
2015利用低成本液態晶體聚合物基板結合覆晶封裝技術之射頻應用許逸翔; Yi-Hsiang Hsu; 張翼; 馬哲申; Chang , Edward-Yi; Maa , Jer-shen; 光電系統研究所
2008利用低成本高分子基板結合覆晶封裝技術之高頻及機械特性之探討胡志偉; Oh Chee Way; 張翼; Edward Yi Chang; 材料科學與工程學系
2012利用鑽石複合材料當作高亮度發光二極體的散熱管理胡人立; 吳耀銓; 材料科學與工程學系
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