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顯示 1 到 17 筆資料，總共 17 筆
公開日期標題作者
1-十一月-200760 GHz broadband Ms-to-CPW hot-via flip chip interconnectsWu, Wei-Cheng; Hsu, Li-Han; Chang, Edward Yi; Kaernfelt, Camilla; Zirath, Herbert; Starski, J. Piotr; Wu, Yun-Chi; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2010An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise ApplicationsWang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2010An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise ApplicationsWang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng; 材料科學與工程學系; Department of Materials Science and Engineering
2011The Circle-grid Electrode on Concentrated GaAs Solar Cells EfficiencyChung, Chen-Chen; Yu, Hung-Wei; Hsu, Li-Han; Kuo, Chien-I; Nguyen-Hong Quan; Chiu, Yu-Sheng; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2010Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging ApplicationsHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-八月-2010Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent ReliabilityHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2009Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip InterconnectsWu, Wei-Cheng; Chang, Edward Yi; Hwang, Ruey-Bing; Hsu, Li-Han; Huang, Chen-Hua; Karnfelt, Camilla; Zirath, Herbert; 材料科學與工程學系; 電信工程研究所; Department of Materials Science and Engineering; Institute of Communications Engineering
1-三月-2012Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHzHsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2008Evaluation of Electrical Characteristics of the Copper-Metallized SPDT GaAs Switches at Elevated TemperaturesWu, Yun-Chi; Chang, Edward Yi; Lin, Yueh-Chin; Hsu, Li-Han; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2013Evaluation of TiN/Cu Gate Metal Scheme for AlGaN/GaN High-Electron-Mobility Transistor ApplicationLin, Yueh-Chin; Chang, Chih-Hsiang; Li, Fang-Ming; Hsu, Li-Han; Chang, Edward Yi; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2010Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band ApplicationsLim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2011Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic SubstrateWang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2010Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency GenerationHsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
30-九月-2010High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereofChang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te
1-一月-2014Investigation of the Flip-Chip Package With BCB Underfill for W-Band ApplicationsWang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
29-十月-2009Vertical Transmission StructureChang, Edward Yi; Wu, Wei-Cheng; Hwang, Ruey-Bing; Hsu, Li-Han
2010毫微米波段覆晶封裝技術之研究與應用許立翰; Hsu, Li-Han; 張翼; Chang, Edward Yi; 材料科學與工程學系
顯示 1 到 17 筆資料，總共 17 筆