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Showing results 1 to 14 of 14
Issue DateTitleAuthor(s)
2013Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State AgingLiu, Tao-Chi; Huang, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2013Eliminate Kirkendall voids in solder reactions on nanotwinned copperLiu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2014Extremely anisotropic single-crystal growth in nanotwinned copperLu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2012Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc ElectrodepositionLiu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2016Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder JointsLin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
15-Oct-2014Grain growth in electroplated (111)-oriented nanotwinned CuHuang, Yi-Sa; Liu, Chien-Min; Chiu, Wei-Lan; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CUChen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
12-May-2015Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Nov-2011An organic hydrogel film with micron-sized pillar array for real-time and indicator-free detection of Zn(2+)Chao, Yu-Chiang; Huang, Yi-Sa; Wang, Hsin-Ping; Fu, Ssu-Ming; Huang, Chien-Hao; Liang, Yen-Chun; Yang, Wen-Cheng; Huang, Yu-Sheng; Chang, Gao-Fong; Zan, Hsiao-Wen; Meng, Hsin-Fei; Hung, Chen-Hsiung; Fu, Chien-Chung; 電子物理學系; 物理研究所; 光電工程學系; Department of Electrophysics; Institute of Physics; Department of Photonics
1-Nov-2011An organic hydrogel film with micron-sized pillar array for real-time and indicator-free detection of Zn2+Chao, Yu-Chiang; Huang, Yi-Sa; Wang, Hsin-Ping; Fu, Ssu-Ming; Huang, Chien-Hao; Liang, Yen-Chun; Yang, Wen-Cheng; Huang, Yu-Sheng; Chang, Gao-Fong; Zan, Hsiao-Wen; Meng, Hsin-Fei; Hung, Chen-Hsiung; Fu, Chien-Chung; 電子物理學系; 物理研究所; 光電工程學系; 光電工程研究所; Department of Electrophysics; Institute of Physics; Department of Photonics; Institute of EO Enginerring
25-May-2012Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned CopperHsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2013具高度(111)優選方向之奈米雙晶銅膜之製備，熱穩定性及其在3D IC封裝的應用黃以撒; Huang, Yi-Sa; 陳智; Chen, Chih; 材料科學與工程學系所
2009訊息分子釋放與偵測之水凝膠薄膜黃以撒; Huang, Yi-Sa; 孟心飛; Meng, Hsin-Fei; 物理研究所
Showing results 1 to 14 of 14