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國立陽明交通大學機構典藏
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顯示 1 到 19 筆資料,總共 19 筆
公開日期
標題
作者
1-五月-2010
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
Liang, S. W.
;
Chen, Chih
;
Han, J. K.
;
Xu, Luhua
;
Tu, K. N.
;
Lai, Yi-Shao
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-八月-2008
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
Hsiao, Hsiang-Yao
;
Liang, S. W.
;
Ku, Min-Feng
;
Chen, Chih
;
Yao, Da-Jeng
;
材料科學與工程學系
;
Department of Materials Science and Engineering
19-二月-2007
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
Liang, S. W.
;
Chiu, S. H.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十月-2010
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
Liang, S. W.
;
Hsiao, H. Y.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十月-2010
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
Liang, S. W.
;
Hsiao, H. Y.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-五月-2009
Effect of bump size on current density and temperature distributions in flip-chip solder joints
Kuan, Wei-Chih
;
Liang, S. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-七月-2008
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
Preciado, Jackie
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2009
Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints
Chen, Tzu Yu
;
Liang, S. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
10-七月-2006
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
Liang, S. W.
;
Chang, Y. W.
;
Shao, T. L.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2007
Effects of current crowding and Joule heating on reliability of solder joints
Liang, S. W.
;
Chiu, S. H.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-九月-2012
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
Chu, Ming-Hui
;
Liang, S. W.
;
Chen, Chih
;
Huang, Annie T.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-三月-2007
Electromigration issues in lead-free solder joints
Chen, Chih
;
Liang, S. W.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-八月-2006
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
Liu, Y. C.
;
Chen, K. H.
;
Lin, S. H.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2006
Joule heating effect under accelerated electromigration in flip-chip solder joints
Chiu, S. H.
;
Liang, S. W.
;
Chen, Chili
;
Yao, D. J.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十二月-2009
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
Liang, S. W.
;
Hsiao, Hsiang-Yao
;
Chen, Chih
;
Xu, Luhua
;
Tu, K. N.
;
Lai, Yi-Shao
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2009
Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints
Liang, S. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十月-2007
Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
17-七月-2006
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
Chang, Y. W.
;
Liang, S. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-二月-2007
Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering