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公開日期標題作者
20053-D simulation on current density distribution in flip-cbip solder joints with thick CuUBM under current stressingLiang, SW; Shao, TL; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2004Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflowShao, TL; Chen, TS; Huang, YM; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2004Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumpsShao, TL; Chen, IH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
15-十月-2004Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization padsShao, TL; Chen, YH; Chiu, SH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2002Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technologyHsu, YC; Shao, TL; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2003Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallizationShao, TL; Lin, KC; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2003Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallizationHsu, YC; Shao, TL; Yang, CJ; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
9-一月-2006Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigrationChiu, SH; Shao, TL; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2005Microstructural evolution during electromigration in eutectic SnAg solder bumpsChen, YH; Shao, TL; Liu, PC; Chen, C; Chou, T; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2004Microstructure evolution during electromigration in eutectic SnPb solder bumpsLu, CM; Shao, TL; Yang, CJ; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2006Relieving the current crowding effect in flip-chip solder joints during current stressingLiang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2004Thermal gradient in solder joints under electrical-current stressingShao, TL; Chiu, SH; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 12 筆資料，總共 12 筆