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國立陽明交通大學機構典藏
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公開日期
標題
作者
1-七月-2013
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
Liang, Y. C.
;
Lin, H. W.
;
Chen, H. P.
;
Chen, C.
;
Tu, K. N.
;
Lai, Y. S.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十月-2012
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
Guo, Ming-Yung
;
Lin, C. K.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-五月-2010
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
Liang, S. W.
;
Chen, Chih
;
Han, J. K.
;
Xu, Luhua
;
Tu, K. N.
;
Lai, Yi-Shao
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-一月-2018
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
Juang, Jing Ye
;
Shie, Kai Cheng
;
Li, Yu Jin
;
Lin, Benson
;
Chang, Chia Cheng
;
Tu, K. N.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2016
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
Lin, C. K.
;
Chen, Chih
;
Chu, David T.
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
13-七月-2018
Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
Tseng, Chih-Han
;
Tu, K. N.
;
Chen, Chih
;
材料科學與工程學系
;
國際半導體學院
;
Department of Materials Science and Engineering
;
International College of Semiconductor Technology
17-九月-2018
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
Juang, Jing-Ye
;
Lu, Chia-Ling
;
Chen, Kuan-Ju
;
Chen, Chao-Chang A.
;
Hsu, Po-Ning
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十二月-2018
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
Juang, Jing-Ye
;
Lu, Chia-Ling
;
Li, Yu-Jin
;
Tu, K. N.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-五月-2012
The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
Huang, Y. S.
;
Hsiao, H. Y.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-六月-2015
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions
Chou, Yi-Chia
;
Tang, Wei
;
Chiou, Chien-Jyun
;
Chen, Kai
;
Minor, Andrew M.
;
Tu, K. N.
;
電子物理學系
;
Department of Electrophysics
1-七月-2008
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
Preciado, Jackie
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
10-七月-2006
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
Liang, S. W.
;
Chang, Y. W.
;
Shao, T. L.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2010
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
Chen, Chih
;
Tong, H. M.
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2006
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
Nah, Jae-Woong
;
Suh, J. O.
;
Tu, K. N.
;
Yoon, Seung Wook
;
Chong, Chai Tai
;
Kripesh, V.
;
Su, B. R.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-七月-2008
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
Wei, C. C.
;
Liu, P. C.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
15-十月-2019
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
Huang, E-Wen
;
Chou, Hung-Sheng
;
Tu, K. N.
;
Hung, Wei-Song
;
Tu-Ngoc Lam
;
Tsai, Che-Wei
;
Chiang, Ching-Yu
;
Lin, Bi-Hsuan
;
Yeh, An-Chou
;
Chang, Shan-Hsiu
;
Chang, Yao-Jen
;
Yang, Jun-Jie
;
Li, Xiao-Yun
;
Ku, Ching-Shun
;
An, Ke
;
Chang, Yuan-Wei
;
Jao, Yu-Lun
;
交大名義發表
;
材料科學與工程學系
;
National Chiao Tung University
;
Department of Materials Science and Engineering
1-四月-2020
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
Gusak, A. M.
;
Tu, K. N.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2016
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
Chen, Chih
;
Liu, Chien-Min
;
Lu, Tien-Lin
;
Lin, Han-wen
;
Chu, Yi-Cheng
;
Lu, Chia-Ling
;
Juang, Jing-Ye
;
Chen, Kuan-Neng
;
Tu, K. N.
;
材料科學與工程學系
;
電子工程學系及電子研究所
;
Department of Materials Science and Engineering
;
Department of Electronics Engineering and Institute of Electronics
2016
Flux-driven cellular precipitation in open system to form porous Cu3Sn
Gusak, Andriy M.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-十二月-2017
Growth competition between layer-type and porous-type Cu3Sn in microbumps
Chu, David T.
;
Chu, Yi-Cheng
;
Lin, Jie-An
;
Chen, Yi-Ting
;
Wang, Chun-Chieh
;
Song, Yen-Fang
;
Chiang, Cheng-Cheng
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering