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公開日期標題作者
1-七月-2013Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder jointsLiang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2012Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder jointsGuo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2010Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigrationLiang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2018Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copperJuang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016Communication-Formation of Porous Cu3Sn by High-Temperature Current StressingLin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
13-七月-2018Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bondingTseng, Chih-Han; Tu, K. N.; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
17-九月-2018Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2018Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned CuJuang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2012The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state solderingHuang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2015Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact ReactionsChou, Yi-Chia; Tang, Wei; Chiou, Chien-Jyun; Chen, Kai; Minor, Andrew M.; Tu, K. N.; 電子物理學系; Department of Electrophysics
1-七月-2008Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigrationLiang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
10-七月-2006Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigrationLiang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2010Electromigration and Thermomigration in Pb-Free Flip-Chip Solder JointsChen, Chih; Tong, H. M.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2006Electromigration in Pb-free solder bumps with Cu column as flip chip jointsNah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2008Electromigration-induced Pb and Sn whisker growth in SnPb solder stripesWei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
15-十月-2019Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium HeatingHuang, E-Wen; Chou, Hung-Sheng; Tu, K. N.; Hung, Wei-Song; Tu-Ngoc Lam; Tsai, Che-Wei; Chiang, Ching-Yu; Lin, Bi-Hsuan; Yeh, An-Chou; Chang, Shan-Hsiu; Chang, Yao-Jen; Yang, Jun-Jie; Li, Xiao-Yun; Ku, Ching-Shun; An, Ke; Chang, Yuan-Wei; Jao, Yu-Lun; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
1-四月-2020Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder jointsGusak, A. M.; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devicesChen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2016Flux-driven cellular precipitation in open system to form porous Cu3SnGusak, Andriy M.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2017Growth competition between layer-type and porous-type Cu3Sn in microbumpsChu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
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