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dc.contributor.authorTu, Chun-Haoen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorLiu, Hsin-Chouen_US
dc.contributor.authorSze, Simon M.en_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2014-12-08T15:15:37Z-
dc.date.available2014-12-08T15:15:37Z-
dc.date.issued2006-10-16en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2362972en_US
dc.identifier.urihttp://hdl.handle.net/11536/11670-
dc.description.abstractThe formation of germanium (Ge) nanocrystals embedded in silicon oxygen nitride (SiON) is proposed for charge storage elements in this work. The Ge nanocrystals can be nucleated after the oxidation process of silicon germanium nitride (SiGeN) layer at high temperatures. Compared to the control samples of Ge nanocrystals/SiO2/Si structure and SiON/Si stack memory, the proposed Ge nanocrystals/SiON/Si memory obtained superior memory window, even larger than the typical sum of both. It is considered that the extra interface trap states between Ge and SiON film were generated as Ge nanocrystals were embedded in SiON layer. (c) 2006 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleImproved memory window for Ge nanocrystals embedded in SiON layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2362972en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume89en_US
dc.citation.issue16en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000241405200050-
dc.citation.woscount50-
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