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dc.contributor.authorChang, Tien-Shunen_US
dc.contributor.authorLu, Tsung Yien_US
dc.contributor.authorChao, Tien-Shengen_US
dc.date.accessioned2014-12-08T15:23:31Z-
dc.date.available2014-12-08T15:23:31Z-
dc.date.issued2012-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://hdl.handle.net/11536/16442-
dc.description.abstractAn effective electron mobility improvement that uses strain-proximity-free technique (SPFT) has been demonstrated using strain-gate engineering. The electron mobility of nMOSFETs with SPFT exhibits a 15% increase over that of counterpart techniques. The preamorphous layer (PAL) gate structure on the SPFT showed a further performance boost. The electron mobility exhibits a 52% improvement in nMOSFET using a combination of SPFT and PAL gate structure. Furthermore, the gain in electron mobility in the SPFT in combination with PAL gate structure decreases at high temperatures. Gate dielectric interface states and ionized gate impurities inducing carrier scattering will play important roles when operating devices under high-temperature conditions.en_US
dc.language.isoen_USen_US
dc.subjectMobilityen_US
dc.subjectnMOSFETsen_US
dc.subjectstrainen_US
dc.subjecttemperatureen_US
dc.titleTemperature Dependence of Electron Mobility on Strained nMOSFETs Fabricated by Strain-Gate Engineeringen_US
dc.typeArticleen_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume33en_US
dc.citation.issue7en_US
dc.citation.epage931en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000305835300005-
dc.citation.woscount3-
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