完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lai, JM | en_US |
dc.contributor.author | Chieng, WH | en_US |
dc.contributor.author | Lin, BC | en_US |
dc.contributor.author | Chin, A | en_US |
dc.contributor.author | Tsai, C | en_US |
dc.date.accessioned | 2014-12-08T15:46:32Z | - |
dc.date.available | 2014-12-08T15:46:32Z | - |
dc.date.issued | 1999-06-01 | en_US |
dc.identifier.issn | 0013-4651 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1149/1.1391916 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/31305 | - |
dc.description.abstract | An intrinsic defect may exist in thin gate oxides. Such a defect can increase the leakage current in a manner similar to stress-induced leakage current. In this paper, we have shown that the effect of this intrinsic defect can be greatly reduced by in situ removal of the native oxide followed by growing a high-quality thermal oxide. By using such in situ cleaning, ultrathin oxides can be prepared with atomically smooth interfaces, good thickness uniformity, and reduced leakage currents. (C) 1999 The Electrochemical Society. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.title | The leakage current effect of thin gate oxides (2.4-2.7 nm) with in situ native oxide desorption | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1149/1.1391916 | en_US |
dc.identifier.journal | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | en_US |
dc.citation.volume | 146 | en_US |
dc.citation.issue | 6 | en_US |
dc.citation.spage | 2216 | en_US |
dc.citation.epage | 2218 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000080930500037 | - |
dc.citation.woscount | 5 | - |
顯示於類別: | 期刊論文 |