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dc.contributor.authorChen, MJen_US
dc.contributor.authorLee, HSen_US
dc.contributor.authorChen, JHen_US
dc.contributor.authorHou, CSen_US
dc.contributor.authorLin, CSen_US
dc.contributor.authorJou, YNen_US
dc.date.accessioned2014-12-08T15:48:52Z-
dc.date.available2014-12-08T15:48:52Z-
dc.date.issued1998-08-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.704398en_US
dc.identifier.urihttp://hdl.handle.net/11536/32496-
dc.description.abstractA new physical model concerning the holding points for latch-up in epitaxial CMOS structures is established by combining the lateral p-i-n high level injection and the vertical BJT base push-out formula. The model matches adequately the correlation between holding voltage and holding current extensively measured from different combinations of temperatures, epitaxial layer thicknesses, and anode-to-cathode spacings, This is also the case for the two-dimensional device simulations. A quantitative analysis based on the model consistently judges the crucial role of the vertical BJT base push-out width in producing the observed correlation. The potential merits of the model in extended applications are outlined.en_US
dc.language.isoen_USen_US
dc.titleA physical model for the correlation between holding voltage and holding current in epitaxial CMOS latch-upen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.704398en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume19en_US
dc.citation.issue8en_US
dc.citation.spage276en_US
dc.citation.epage278en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000074931000002-
dc.citation.woscount1-
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