台灣半導體產業3D IC技術選擇模式

Abstract

選擇適當的技術有助於企業作出更具競爭力的產品和服務，或是開發更有效的流程，為企業創造全新的解決方案，以利企業在競爭激烈的商業環境中取得競爭優勢。但先進技術多樣且日益複雜，使得企業在技術選擇的決策上更加的困難。3D IC是半導體產業中下一個世代的關鍵技術，如何在各種不同的3D IC技術中選擇出一個具有發展潛力且能夠創造商業價值之核心技術，實為目前有意投入3D IC產業之各個廠商必需思考且急需面對的問題。 本文提出適用於3D IC技術選擇決策之5項構面與18項準則，以協助企業在技術選擇決策時有所依據。在技術選擇決策方法上則使用了基於決策實驗室法之網路程序分析(DEMATEL Based ANP, DANP)以求得各項構面準則之因果關聯性及重要性排序，再搭配折衷排序法(VlseKriterijumska Optimizacija I Kompromisno Resenje, VIKOR)以求得個別適選技術之整體績效，來協助判斷是否投入該項技術開發，以及若投入該技術開發時應注意的關鍵重點。本研究數據顯示目前最佳的3D IC技術為Si Interposer，Via-Middle次之，再其次為Via-Last，最後為Via-First。企業欲投入3D IC之技術開發應首重產業鏈之完整度以提高技術開發成功率。

Selecting an appropriate technology helps companies to make more competitive products and services, and gains competitive advantage in a competitive business environment. It’s more difficult to do technology selection due to advanced technologies are diverse and increasingly complex. 3D IC is the key technology of the semiconductor industry in the next generation, how to select a 3D IC technology, which creates high business value, is the key problem that manufacturers are facing now. In this paper, 5 dimensions with 18 criteria for 3D IC technology selection are developed. In order to know the causal association and the importance of each dimension and criterion, Decision Making Trial and Evaluation Laboratory based Analytic Network Process (DEMATEL Based ANP, DANP) is used for this study, VlseKriterijumska Optimizacija I Kompromisno Resenje (VIKOR) is also used to evaluate overall performance of each candidate. These data suggest that the best 3D IC technology is the Si Interposer. The companies want to develop 3D IC technology should consider the completeness of industrial chain in order to improve the success rate of technology development.