台灣IC封裝測試業競爭策略分析-以A公司為例

Abstract

全球IDM (Integrated Device Manufacture)大廠為了降低生產成本，明顯的增加委外代工的比率，造成IC設計、製造、封裝、測試等專業代工的趨勢越形顯著，由於台灣半導體產業的群聚效應明顯，遂成為國際IDM大廠親睞的對象，因此台灣相關專業廠商便成為訂單釋放的重要對象，國內專業封裝大廠日月光、矽品、華泰等業者將受惠良多，彼此之間的競爭也勢不可免。因此分析產業的現況、確認產業的關鍵成功因素與分析研究公司內部的競爭態勢，成為公司未來定位與成功競爭的重要策略參考。 本研究探討IC封裝產業之關鍵成功因素，分析IC封裝產業的現況與態勢，並進一步定量的分析業界專家學者的意見，歸納出IC封裝產業之關鍵成功因素。進行定性分析討論IC封裝產業之關鍵成功因素與A公司核心能力的差異，藉由實務訪談以定位A公司的經營策略，進一步了解A公司的策略意涵。 本研究藉由文獻的回顧與歸納整理，建立關鍵成功因素的研究模型，再將研究模型設計為問卷，請相關產業人士填寫，並利用因子分析法進行定量的分析。 藉由因子分析法進行問卷的定量分析，歸納整理出封裝產業的關鍵成功因素，配合訪談A公司的核心人員，比較A公司的核心能力與產業關鍵成功因素，進一步規納整理出A公司的競爭策略與策略建議。本研究發現歸納出五個關鍵成功因素：（1）企業供應商議價能力與成本因子、（2）產品知名度與轉換成本因子、（3）生產管理與產品行銷因子、（4）財務管理與新產品導入因子、（5）向下整合策略因子。 本研究發現IC封裝企業目前之競爭經營策略為低成本領導策略，隨著應用產品的特性需求改變，逐漸走向多元化經營、多角化與策略聯盟微未來發展趨勢、朝大陸市場為企業多元化競爭的重要利基點、拓展國際市場掌握IDM訂單搶佔市場佔有率。

In order to lower manufacturing cost, global IDM companies raise their outsourcing rate in these two years. Because the IC clustering effect in Taiwan is obvious that global IDM companies like to order IC product in Taiwan. It is important for Taiwan IC assembly and test companies to identify the key successful factor, review themselves, and come out a competitive strategy. This study is focused on the analysis of IC Assembly and Test Industry for its future developments and its current strategy. Factor analysis is employed to find the key success factors (KSF) to analyze the possible developments and trends in the future. For a more optimal research results, case study and special interviews with experts were conducted. Five out of 54 different key factors were the most affective factors that effect the future developments and trends in IC Assembly and Test industry, such as negotiation strategy of supplier & cost leadership factor, Brand name and exchange supplier cost, product manufacturing and marketing factor, financial management and new product implement factor, downward Integrating strategy factor This study concludes that the competitive strategy of IC assembly and test industry nowadays is low cost leadership and will toward diversification and strategic alliance in the future. The IC assembly and test companies in Taiwan should grab the future business opportunity in China