台灣晶圓測試產業競爭策略之研究-以A 公司為例

Abstract

隨著半導體晶片尺寸邁入12吋的時代，半導體製程也由0.13微米，進入到90奈米、65奈米的世代。各半導體晶圓製造公司，不論是晶圓代工廠商或者是整合元件大廠，一方面需專精於12吋晶圓廠之建制、另一方面因12吋廠的資金需求高達600億以上，且隨著產品的功能越來越強，晶圓測試設備也越來越貴，而使得原本附屬於晶圓代工廠或整合元件廠的晶圓測試業務，逐年調高委外代工以重。因此，晶圓測試代工產業因此而生。 本論文藉由半導體封裝測試產業的探討，進一步分析晶圓測試產業的概況，並藉由對個案公司的內部分析、產業五力分析、SWOT分析與績效之檢核，進一步闡述在此新興業務尚屬成長期的階段下，產業中的廠商如何調整策略以因應半導體產業的景氣循環變化。

When the wafer size becomes 12 inches and the wafer process become 90nm or 65nm from 0.13um, the companies working as a semiconductor ones, no matter Foundry or IDM, need to put attention on how to build a 12 inches factory and also, it costs too much on a 12 inches factory. So, the wafer probing business used to accompany with IDM or Foundry was subcontracted to sub cons. So, the wafer probing industry is established recently according to this phenomenon. This study starts with the analysis of assembly and testing industry, followed by analyzing the wafer probing industry. Through the analysis of a specified company by 5 forces and SWOT, provide suggestions to the companies that located at the growing new subcontracted environment on how to adjust the company strategy to fit the semiconductor’s boom circles.