| 標題: | 高密度多層構裝基板與接合材料研究---子計畫II：銅接合-低介電係數介電層之界面可靠度提升研究 Reliability Enhancement for Copper Interconnect-Low K Dielectric Interconnect |
| 作者: | 邱碧秀 CHIOU BI-SHIOU 交通大學電子工程系 |
| 公開日期: | 2000 |
| 官方說明文件#: | NSC89-2216-E009-017 |
| URI: | http://hdl.handle.net/11536/90308 https://www.grb.gov.tw/search/planDetail?id=720602&docId=135385 |
| Appears in Collections: | Research Plans |
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