Title: 銅化學氣相沈積技術及積體電路銅製程相關的材料與製程技術研究(II)
Cu-CVD Technology and Reliability Issues of Cu Metallization Relevant to ULSI Application (II)
Authors: 陳茂傑
國立交通大學電子工程學系
Issue Date: 2000
Gov't Doc #: NSC89-2215-E009-101
URI: http://hdl.handle.net/11536/93859
https://www.grb.gov.tw/search/planDetail?id=583878&docId=109704
Appears in Collections:Research Plans


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