| Title: | 積體電路化學品與材料之開發---子計畫VI：積體電路封裝用聚亞醯胺納米複合材料材機械及電氣性質之研究(II) A Study on the Mechanical and Electrical Properties of Polyimide Nancomposites for Integrated Circuit Packaging Application (II) |
| Authors: | 韋光華 KUNG-HWAWEI 交通大學材料科學與工程研究所 |
| Keywords: | 聚亞醯胺;納米複合材料;積體電路;構裝;機械性質;Polyimide;Nanocomposite;Integrated circuit;Packaging;Mechanical property |
| Issue Date: | 1999 |
| Gov't Doc #: | NSC88-CPC-E009-007 |
| URI: | http://hdl.handle.net/11536/94133 https://www.grb.gov.tw/search/planDetail?id=460500&docId=84321 |
| Appears in Collections: | Research Plans |
