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Issue DateTitleAuthor(s)
25-Sep-2004The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thioureaKao, YL; Tu, GC; Huang, CA; Chang, JH; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2004Characteristics of the rough-cut surface of quenched and tempered martensitic stainless steel using wire electrical discharge machiningHuang, CA; Tu, GC; Yao, HT; Kuo, HH; 交大名義發表; National Chiao Tung University
1-Jan-2006CoSix thermal stability on narrow-width polysilicon resistorsChen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY; 材料科學與工程學系; Department of Materials Science and Engineering
1-Feb-2006The effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pHKao, YL; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2001Effect of catalyst on growth behavior of carbon nanotube synthesizing by microwave heating thermal chemical vapor deposition processChen, SC; Shih, LY; Chang, YC; Tu, GC; Lin, IN; 材料科學與工程學系; Department of Materials Science and Engineering
1-Sep-1997The effect of indium impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usageLin, W; Tu, GC; Lin, CF; Peng, YM; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-1996The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usageLin, W; Tu, GC; Lin, CF; Peng, YM; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-1996The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usageLin, W; Tu, GC; Lin, CF; Peng, YM; 材料科學與工程學系; Department of Materials Science and Engineering
30-Oct-2003The electrochemical behavior of tin-doped indium oxide during reduction in 0.3 M hydrochloric acidHuang, CA; Li, KC; Tu, GC; Wang, WS; 材料科學與工程學系; Department of Materials Science and Engineering
21-Dec-2005The electrochemical polishing behavior of porous austenitic stainless steel (AISI 316L) in phosphoric-sulfuric mixed acidsChen, SC; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering
2001Fabrication and characterization of Cu-SiCp composites for electrical discharge machining applicationsShu, KM; Tu, GC; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-1996Fabrication and microstructure of the dc-magnetron-sputtered YBa2Cu3O7-x superconducting thin filmsKoo, HS; Tseng, TY; Chang, WR; Tu, GC; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Aug-2000Hard chromium plating on cold swaged Cr-Mo steel using rotating cylinder electrodeHuang, CA; Tu, GC; Liao, MC; Kao, YL; 材料科學與工程學系; Department of Materials Science and Engineering
2005Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bathKao, YL; Li, KC; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering
25-May-2003The microstructure and the thermal expansion characteristics of Cu/SiCp compositesShu, KM; Tu, GC; 材料科學與工程學系; Department of Materials Science and Engineering
9-Jun-2004Nanomechanical properties of nanocrystalline Ni-Fe mold insertYeh, YM; Tu, GC; Fang, TH; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2006Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active regionChen, YM; Tu, GC; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2005Reverse CoSi(2) thermal stability and digitized sheet resistance increase of sub-90 nm polysilicon linesLo, CY; Peng, YC; Chen, YM; Tu, GC; Lin, SS; Chen, WM; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2004Simulation analysis and experimental verification of LIGA-like process for Ni-Fe micromold insert with taper angleFu, MN; Yeh, YM; Tu, GC; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2003Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio Ni-Fe micro-mold insertYeh, YM; Tu, GC; Fu, MN; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 20 of 23  next >