瀏覽 的方式: 作者 Lu, Chia-Ling

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公開日期標題作者
1-一月-2017Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
17-九月-2018Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2018Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned CuJuang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
19-八月-2014Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Lu, Chia-Ling; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2015Electrochemical performance of graphite anode with various electrode compressibilities for long-life Li-ion batteryDeng, Min-Jen; Tsai, Du-Cheng; Lu, Chia-Ling; Li, Ching-Fei; Shieu, Fuh-Sheng; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2014Extremely anisotropic single-crystal growth in nanotwinned copperLu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2016Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devicesChen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2018Growth Mechanism of Self-Assembled TixWyO Nanotubes Fabricated by TiW Alloy AnodizationChang, Yung-Huang; Chen, Yuan-Tsung; Huang, Chien-Sheng; Lu, Chia-Ling; Lee, Shih-Hung; Huang, Bohr-Ran; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2017Low temperature Cu-Cu direct bonding by (111) oriented nano-twin CuJuang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
25-五月-2012Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned CopperHsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2015以脈衝電鍍製備具有 (111) 優選方向之奈米雙晶銅膜以及熱處理之後 (100) Cu異方性單晶成長呂佳凌; Lu, Chia-Ling; 陳智; Chen, chih; 材料科學與工程學系所