标题: | 两岸半导体产业合作可行性分析 A Study on the Collaboration Opportunities in the Semiconductor Industry Between Taiwan and Mainland Chinnna |
作者: | 陈钜盛 Chen Chu sheng 袁建中 Benjamin Yuan 科技管理研究所 |
关键字: | 半导体;产业分析;合作可行性;晶圆代工;封装;IC;Industry analysis;collaboration;foundry;packaging;opportunities |
公开日期: | 1998 |
摘要: | IC是电子产品的重要零组件,也是电子科技进步重要动力,同时,IC产业又是高科技产业,因此两岸都将IC产业列为重点发展项目。近年来,台湾IC产业蓬勃发展,厂商开拓大陆市场成重要环节,应否赴大陆投资也是政府与业者共同关心的问题。 大陆目前半导体业仍处于起步阶段,发展主力集中在晶圆代工与封装业务,晶圆代工是国际半导体业发展的一个趋势,而封装业也能充分利用大陆低廉的劳力供给的优势。对台湾而言,大陆是未来半导体市场最具发展潜力的地区,除此之外台湾与大陆半导体在资金、技术、劳动力…等等方面都有互补的关系。本研究之目地在综合比较两岸半导体业的优、劣势与产业机会,进一步对两岸合作模式提出建言。 ABSTRACT The integrated circuit (IC), an essential component of electronic products, provides the impetus for improving electronic technologies. Both Taiwan and Mainland China view IC industry as a targeted area for future growth. The Taiwanese IC industry has continuously grown at an accelerated pace, with local companies attempting to fully exploit the Mainland China market. Nevertheless, governmental authorities and risks involved in investing in Mainland China. The Mainland China IC industry is still in its infant stage, focusing mainly on foundry and packaging. The IC industry views the foundry as a targeted for future growth, and Mainland China can take advantage of cheap manpower in packing industry. The potential for collaboration between Taiwan and Mainland China is quiet promising, as both complement each other in areas such as capital technology and manpower. This study analyzes the strengths and limitation of possible collaboration between Taiwan and Mainland China. A model of collaboration between Taiwan and Mainland China in the IC industry is also constructed. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT870230006 http://hdl.handle.net/11536/63969 |
显示于类别: | Thesis |