集束型設備傳輸模組控制器及通訊模組設計與測試

Abstract

本文的目的在於利用軟體工程上所謂的物件導向分析與設計（OOAD），設計一套滿足半導體工業標準（SEMI standard）的集束型設備傳輸模組控制器（TMC）及通訊模組軟體。 傳輸模組控制器透過通訊模組可與集束型控制器（CTC）、前端模組控制器（FEMC）與製程模組控制器（PMC）相互溝通進行訊息交握；傳輸模組控制器並以Java Communication API透過RS232實際驅動底層硬體動作，如真空機械手臂、卡匣模組等。進而完成整個集束型設備控制器的整合，達到晶圓的自動化傳輸。 通訊模組則應用設計模式（Design Pattern）的概念設計軟體架構， 使通訊模組滿足SEMI-E5 SECSII與SEMI-E37 HSMS等標準對訊息的規範，以達到各半導體設備控制器間連線的建立與管理、及對SECS訊息的編寫與傳送、接收。通訊模組使得集束型控制器（CTC）、傳輸模組控制器（TMC）、前端模組控制器（FEMC）與製程模組控制器（PMC）能彼此相互溝通完成晶圓製程的自動化、事件回報與例外處理的功能。

This thesis focuses on how to use Object Oriented Analysis and Design (OOAD) to design cluster tool transfer module controller (TMC) and SECS communication module conforming to the SEMI standard. By using the developed SECS communication module, TMC has the capacity to communicate with cluster tool controller (CTC), front-end module controller (FEMC) and process module controller (PMC). Through RS232 Interface, TMC can drive the components of semiconductor equipment, instead of JNI interface, directly by Java communication API. TMC also has the ability to report events to CTC and to handle exceptions. Finally, CTC, TMC, FEMC and PMC can be hooked up all together to process and transfer wafers automatically. In the development of SECS communication module conforming to the SEMI-E5 SECS II and SEMI-E37 HSMS standard, we use Design Patterns, in particular component pattern and visitor pattern. The feature of this approach is the flexibility and reusability of the module. When the SECS communication module in on duty, the controllers, like TMC or CTC, have the ability to establish connection to other controllers and to send or receive SECS messages. The testing procedures are presented in the thesis as well as testing results