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公開日期
標題
作者
2015
3D Heterogeneous Integration Structure Based on 40 nm- and 0.18 mu m- Technology Nodes
Hu, Yu-Chen
;
Lin, Chun-Pin
;
Hsieh, Yu-Sheng
;
Chang, Nien-Shyang
;
Gallegos, Anthony J.
;
Souza, Terry
;
Chen, Wei-Chia
;
Sheu, Ming-Hwa
;
Chang, Chien-Chi
;
Chen, Chi-Shi
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
A 64-CHANNEL WIRELESS NEURAL SENSING MICROSYSTEM WITH TSV-EMBEDDED MICRO-PROBE ARRAY FOR NEURAL SIGNAL ACQUISITION
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Hu, Yu-Chen
;
Wu, Shang-Lin
;
You, Yan-Huei
;
Wang, Yung-Kuei
;
Duann, Jeng-Ren
;
Chiu, Tzai-Wen
;
Hwang, Wei
;
Chen, Kuan-Neng
;
Chuang, Ching-Te
;
Chiou, Jin-Chern
;
生物科技學系
;
電機工程學系
;
電控工程研究所
;
國際半導體學院
;
Department of Biological Science and Technology
;
Department of Electrical and Computer Engineering
;
Institute of Electrical and Control Engineering
;
International College of Semiconductor Technology
1-四月-2017
An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
Hu, Yu-Chen
;
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Chang, Hsiao-Chun
;
Yang, Yu-Tao
;
You, Yan-Huei
;
Chen, Jr-Ming
;
Huang, Yan-Yu
;
Lin, Yen-Han
;
Duann, Jeng-Ren
;
Chiu, Tzai-Wen
;
Hwang, Wei
;
Chuang, Ching-Te
;
Chiou, Jin-Chern
;
Chen, Kuan-Neng
;
生物科技學系
;
電子工程學系及電子研究所
;
電控工程研究所
;
Department of Biological Science and Technology
;
Department of Electronics Engineering and Institute of Electronics
;
Institute of Electrical and Control Engineering
1-一月-2016
An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System
Hu, Yu-Chen
;
Lin, Chun-Pin
;
Chang, Hsiao-Chun
;
Yang, Yu-Tao
;
Chen, Chi-Shi
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2014
Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Lee, Shih-Wei
;
Hu, Yu-Chen
;
Chiu, Chih-Hung
;
Lo, Chung-Lun
;
Chang, Chi-Chung
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-八月-2013
Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic Sealing
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiu, Chih-Hung
;
Hu, Yu-Chen
;
Lo, Chung-Lun
;
Chang, Chi-Chung
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2016
Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substate Integration
Hu, Yu-Chen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2018
Graphene oxide sensitizes cancer cells to chemotherapeutics by inducing early autophagy events, promoting nuclear trafficking and necrosis
Lin, Kuan-Chen
;
Lin, Mei-Wei
;
Hsu, Mu-Nung
;
Guan Yu-Chen
;
Chao, Yu-Chan
;
Tuan, Hsing-Yu
;
Chiang, Chi-Shiun
;
Hu, Yu-Chen
;
生物科技學系
;
分子醫學與生物工程研究所
;
Department of Biological Science and Technology
;
Institute of Molecular Medicine and Bioengineering
1-一月-2017
An Implantable 128-Channel Wireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable mu-Needle Array and Flexible Interposer
Huang, Po-Tsang
;
Huang, Yu-Chieh
;
Wu, Shang-Lin
;
Hu, Yu-Chen
;
Lu, Ming-Wei
;
Sheng, Ting-Wei
;
Chang, Fung-Kai
;
Lin, Chun-Pin
;
Chang, Nien-Shang
;
Chen, Hung-Lieh
;
Chen, Chi-Shi
;
Duann, Jeng-Ren
;
Chiu, Tzai-Wen
;
Hwang, Wei
;
Chen, Kuan-Neng
;
Chuang, Ching-Te
;
Chiou, Jin-Chern
;
生物科技學系
;
電子工程學系及電子研究所
;
電控工程研究所
;
國際半導體學院
;
Department of Biological Science and Technology
;
Department of Electronics Engineering and Institute of Electronics
;
Institute of Electrical and Control Engineering
;
International College of Semiconductor Technology
2016
Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits
Huang, Yu-Chieh
;
Hu, Yu-Chen
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
You, Yan-Huei
;
Chen, Jr-Ming
;
Huang, Yan-Yu
;
Chang, Hsiao-Chun
;
Lin, Yen-Han
;
Duann, Jeng-Ren
;
Chiu, Tzai-Wen
;
Hwang, Wei
;
Chuang, Ching-Te
;
Chiou, Jin-Chern
;
Chen, Kuan-Neng
;
交大名義發表
;
National Chiao Tung University
2012
Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration
Chiang, Cheng-Hao
;
Hu, Yu-Chen
;
Chen, Kuo-Hua
;
Chiu, Chi-Tsung
;
Chuang, Ching-Te
;
Hwang, Wei
;
Chiou, Jin-Chern
;
Tong, Ho-Ming
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2012
Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations
Hu, Yu-Chen
;
Chiang, Cheng-Hao
;
Chen, Kuo-Hua
;
Chiu, Chi-Tsung
;
Chuang, Ching-Te
;
Hwang, Wei
;
Chiou, Jin-Chern
;
Tong, Ho-Ming
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-七月-2016
A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration
Hu, Yu-Chen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-十二月-2015
A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node
Hu, Yu-Chen
;
Lin, Chun-Pin
;
Chang, Yao-Jen
;
Chang, Nien-Shyang
;
Sheu, Ming-Hwa
;
Chen, Chi-Shi
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2016
Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D Integration
Yang, Yu-Tao
;
Hu, Yu-Chen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2014
Research of Electroplating and Electroless Plating for Low Temperature Bonding in 3D Heterogeneous Integration
Hu, Yu-Chen
;
Chang, Yao-Jen
;
Wu, Chun-Shen
;
Cheng, Yung Mao
;
Chen, Wei Jen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-五月-2013
Sealing Bump With Bottom-Up Cu TSV Plating Fabrication in 3-D Integration Scheme
Chiang, Cheng-Hao
;
Kuo, Li-Min
;
Hu, Yu-Chen
;
Huang, Wen-Chun
;
Ko, Cheng-Ta
;
Chen, Kuan-Neng
;
電子物理學系
;
電子工程學系及電子研究所
;
Department of Electrophysics
;
Department of Electronics Engineering and Institute of Electronics
2013
TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiang, Cheng-Hao
;
Chiu, Chih-Hung
;
Hu, Yu-Chen
;
Lo, Chung-Lun
;
Chang, Chi-Chung
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-十月-2017
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Hu, Yu-Chen
;
You, Yan-Huei
;
Chen, Jr-Ming
;
Huang, Yan-Yu
;
Chang, Hsiao-Chun
;
Lin, Yen-Han
;
Duann, Jeng-Ren
;
Chiu, Tzai-Wen
;
Hwang, Wei
;
Chen, Kuan-Neng
;
Chuang, Ching-Te
;
Chiou, Jin-Chern
;
生物科技學系
;
電子工程學系及電子研究所
;
電機工程學系
;
電控工程研究所
;
Department of Biological Science and Technology
;
Department of Electronics Engineering and Institute of Electronics
;
Department of Electrical and Computer Engineering
;
Institute of Electrical and Control Engineering
1-二月-2018
Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration
Shen, Wen-Wei
;
Chang, Hsiao-Chun
;
Yang, Yu-Tao
;
Hu, Yu-Chen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics