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公開日期標題作者
2014Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding StructureShih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
9-六月-2008Complementary inverter circuits based on p-SnO(2) and n-In(2)O(3) thin film transistorsDhananjay; Chu, Chih-Wei; Ou, Chun-Wei; Wu, Meng-Chyi; Ho, Zhong-Yo; Ho, Kuo-Chuan; Lee, Shih-Wei; 光電工程學系; Department of Photonics
9-六月-2008Complementary inverter circuits based on p-SnO2 and n-In2O3 thin film transistorsDhananjay; Chu, Chih-Wei; Ou, Chun-Wei; Wu, Meng-Chyi; Ho, Zhong-Yo; Ho, Kuo-Chuan; Lee, Shih-Wei; 光電工程學系; Department of Photonics
1-一月-2017Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D IntegrationChang, Geng-Ming; Lee, Shih-Wei; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-四月-2017Development of Bumpless Stacking With Bottom-Up TSV FabricationLee, Shih-Wei; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-二月-2015A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applicationsChang, Chih-Wei; Chou, Lei-Chun; Huang, Po-Tsang; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chiou, Jin-Chern; 交大名義發表; National Chiao Tung University
2016Electrical Testing Structure for Stacking Error Measurement in 3D IntegrationLee, Shih-Wei; Kuo, Shu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2017Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding TechnologyLee, Shih-Wei; Chang, Ching-Yun; Chang, Geng-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2008High-performance single-layer polymer electrophosphorescent devices with polymer oxidesChen, Fang-Chung; Chien, Shang-Chieh; Lee, Shih-Wei; 光電工程學系; 顯示科技研究所; Department of Photonics; Institute of Display
1-一月-2014Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording ApplicationChou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-二月-2018A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D IntegrationLee, Shih-Wei; Kuo, Shu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2017A Novel Sealing Redistribution Layer Approach for Through-Glass via FabricationLee, Shih-Wei; Chang, Geng-Ming; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2008Polymer photovoltaic devices with highly transparent cathodesChen, Fang-Chung; Wu, Jyh-Lih; Hsieh, Kuo-Huang; Chen, Wen-Chang; Lee, Shih-Wei; 光電工程學系; 顯示科技研究所; Department of Photonics; Institute of Display
2014Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test VehicleLee, Shih-Wei; Shih, Jian-Yu; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2017Polymer-Based Liner TSV Fabrication Scheme and Its Resistance VariationLee, Shih-Wei; Shih, Jian-Yu; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Single Sided Heating Method for Chip-to-Wafer Bonding with Submicron Cu/In InterconnectsChang, Ching-Yun; Lee, Shih-Wei; Chang, Geng-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2019Synthesis and characterization of heterocyclic conjugated polymers containing planar benzo[c]cinnoline and tetraazapyrene structures for organic field-effect transistor applicationLee, Shih-Wei; Chien, Shih-Hsuan; Chen, Jyh-Chien; Wang, Shih-Hao; Wang, Lee-Yih; Lai, Bo-Han; Wang, Chien-Lung; 應用化學系; Department of Applied Chemistry
1-一月-2013Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing ApplicationsChang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
1-二月-2014A TSV-Based Bio-Signal Package With mu-Probe ArrayChou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-一月-2014A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe ArrayChou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
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