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公開日期標題作者
1-七月-2013An Efficient Method for Analyzing On-Chip Thermal Reliability Considering Process VariationsLee, Yu-Min; Huang, Pei-Yu; 電機資訊學士班; Undergraduate Honors Program of Electrical Engineering and Computer Science
1-五月-2009Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral TransformsHuang, Pei-Yu; Lee, Yu-Min; 電信工程研究所; Institute of Communications Engineering
2010A Hierarchical Bin-Based Legalizer for Standard-Cell Designs with Minimal DisturbanceLee, Yu-Min; Wu, Tsung-You; Chiang, Po-Yi; 交大名義發表; National Chiao Tung University
2007Hierarchical power delivery network analysis using Markov chainsHuang, Pei-Yu; Lin, Chih-Kang; Lee, Yu-Min; 電信工程研究所; Institute of Communications Engineering
1-一月-2013I-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICsPan, Chi-Wen; Lee, Yu-Min; Huang, Pei-Yu; Yang, Chi-Ping; Lin, Chang-Tzu; Lee, Chia-Hsin; Chou, Yung-Fa; Kwai, Ding-Ming; 電信工程研究所; Institute of Communications Engineering
2013ICEPL: 考慮溫度與熱梯度的熱感知平面擺置陳思翰; Chen, Si-Han; 李育民; Lee, Yu-Min; 電信工程研究所
1-十二月-2017InTraSim: Incremental Transient Simulation of Power GridsLee, Yu-Min; Ho, Chia-Tung; 電機工程學系; Department of Electrical and Computer Engineering
1-一月-2019Learning Based Mesh Generation for Thermal Simulation in Handheld Devices with Variable Power ConsumptionLo, Wen-Sheng; Chiou, Hong-Wen; Hsu, Shih-Chieh; Lee, Yu-Min; Cheng, Liang-Chia; 交大名義發表; National Chiao Tung University
1-八月-2015LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICsLee, Yu-Min; Pan, Chi-Wen; Huang, Pei-Yu; Yang, Chi-Ping; 電機資訊學士班; Undergraduate Honors Program of Electrical Engineering and Computer Science
1-一月-2019Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile DevicesHsiao, Hsuan-Hsuan; Chiou, Hong-Wen; Lee, Yu-Min; 交大名義發表; 電信工程研究所; National Chiao Tung University; Institute of Communications Engineering
2009A Multiple Supply Voltage Based Power Reduction Method in 3-D ICs Considering Process Variations and Thermal EffectsYu, Shih-An; Huang, Pei-Yu; Lee, Yu-Min; 電信工程研究所; Institute of Communications Engineering
2015NaDaP:三維積體電路針對矽穿孔雜訊及分佈密度改良的佈局擺置盤冠德; 李育民; Pan, Kuan-Te; Lee, Yu-Min; 電信工程研究所
1-五月-2017NaPer: A TSV Noise-Aware PlacerLee, Yu-Min; Pan, Kuan-Te; Chen, Chun; 電機工程學系; Department of Electrical and Computer Engineering
1-一月-2013NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICsLee, Yu-Min; Wu, Tsung-Heng; Huang, Pei-Yu; Yang, Chi-Ping; 交大名義發表; National Chiao Tung University
2012On-Chip Statistical Hot-Spot Estimation Using Mixed-Mesh Statistical Polynomial Expression Generating and Skew-Normal Based Moment Matching TechniquesHuang, Pei-Yu; Lee, Yu-Min; Pan, Chi-Wen; 電機工程學系; Department of Electrical and Computer Engineering
1-一月-2019Phone-nomenon: A System-Level Thermal Simulator for Handheld DevicesChiou, Hong-Wen; Lee, Yu-Min; Shiau, Shin-Yu; Pan, Chi-Wen; Chen, Tai-Yu; 交大名義發表; 電信工程研究所; National Chiao Tung University; Institute of Communications Engineering
2009Post-Routing Redundant Via Insertion with Wire Spreading CapabilityLei, Cheok-Kei; Chiang, Po-Yi; Lee, Yu-Min; 電信工程研究所; Institute of Communications Engineering
1-一月-2013Power Delivery Network Design for Wiring and TSV Resource Minimization in TSV-Based 3-D ICsWei, Shu-Han; Lee, Yu-Min; Ho, Chia-Tung; Sun, Chih-Ting; Cheng, Liang-Chia; 電機工程學系; Department of Electrical and Computer Engineering
2013Power Delivery Network Design for Wiring and TSV Resource Minimization in TSV-Based 3-D ICsWei, Shu-Han; Lee, Yu-Min; Ho, Chia-Tung; Sun, Chih-Ting; Cheng, Liang-Chia; 電機資訊學士班; Undergraduate Honors Program of Electrical Engineering and Computer Science
2011Redundant Via Insertion under Timing ConstraintsPan, Chi-Wen; Lee, Yu-Min; 交大名義發表; National Chiao Tung University
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