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Showing results 1 to 17 of 17
Issue DateTitleAuthor(s)
Jun-20163D resistive RAM cell design for high-density storage class memory-a reviewHudec, Boris; Hsu, Chung-Wei; Wang, I-Ting; Lai, Wei-Li; Chang, Che-Chia; Wang, Taifang; Frohlich, Karol; Ho, Chia-Hua; Lin, Chen-Hsi; Hou, Tuo-Hung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Co-sputtered Cu/Ti Bonded Interconnects for 3D Integration ApplicationsChen, Hsiao-Yu; Hsu, Sheng-Yao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2016The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated LayerLiang, Hao-Wen; Chen, Hsiu-Chi; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-2010Investigation and Effects of Wafer Bow in 3D Integration Bonding SchemesChen, K. N.; Zhu, Y.; Wu, W. W.; Reif, R.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2015Investigation of Low Temperature Cu/In Bonding in 3D IntegrationHsieh, Yu-Sheng; Shen, Ting-Ting; Chien, Yu-San; Chen, Kuan-Neng; Shinozaki, Yuko; Kawasaki, Naohiko; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Low Temperature (< 180 degrees C) Bonding for 3D IntegrationHuang, Yan-Pin; Tzeng, Ruoh-Ning; Chien, Yu-San; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2014A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor DevicesKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2016A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate IntegrationHu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2017A Novel Sealing Redistribution Layer Approach for Through-Glass via FabricationLee, Shih-Wei; Chang, Geng-Ming; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-2017Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabricationChen, Hong-Yu; Brivio, Stefano; Chang, Che-Chia; Frascaroli, Jacopo; Hou, Tuo-Hung; Hudec, Boris; Liu, Ming; Lv, Hangbing; Molas, Gabriel; Sohn, Joon; Spiga, Sabina; Teja, V. Mani; Vianello, Elisa; Wong, H. -S. Philip; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2014Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC ApplicationChang, Yao-Jen; Hsieh, Yu-Sheng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D IntegrationTsai, Tsung-Yen; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電機工程學系; Department of Electrical and Computer Engineering
2015三維積體電路之超薄緩衝層技術於細間距銅/錫襯墊接合開發及電性研究謝佑生; Hsieh, Yu-Sheng; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
2015三維積體電路之頻率振盪元件封裝特性與應用施建宇; Shih, Jian-Yu; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
2012三維積體電路技術之銅/銦金屬低溫接合研究簡妤珊; Chien, Yu-San; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
2014低溫晶圓接合研究及其三維堆疊整合應用柯正達; Ko, Cheng-Ta; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
Showing results 1 to 17 of 17