1. 目前位置：

瀏覽 的方式： 作者 Chiu, Chi-Tsung

跳到： 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
或是輸入前幾個字：  
顯示 1 到 20 筆資料，總共 20 筆
公開日期標題作者
1-一月-20142.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing ApplicationsHuang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
2013Area-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing ApplicationsHuang, Teng-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-二月-2015A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applicationsChang, Chih-Wei; Chou, Lei-Chun; Huang, Po-Tsang; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chiou, Jin-Chern; 交大名義發表; National Chiao Tung University
2015Electrical Investigation of Cu Pumping in Through-Silicon Vias for BEOL Reliability in 3D IntegrationCheng, Chuan-An; Sugie, Ryuichi; Uchida, Tomoyuki; Chen, Kou-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2014Energy-Efficient Configurable Discrete Wavelet Transform for Neural Sensing ApplicationsWang, Tang-Hsuan; Huang, Po-Tsang; Chen, Kuan-Neng; Chiou, Jin-Chem; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電機工程學系; Department of Electrical and Computer Engineering
1-一月-2014Energy-Efficient Low-Noise 16-Channel Analog-Front-End Circuit for Bio-potential AcquisitionWu, Shang-Lin; Huang, Po-Tsang; Huang, Teng-Chieh; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2014Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording ApplicationChou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
2012Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D IntegrationChiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Low Temperature (< 180 degrees C) Bonding for 3D IntegrationHuang, Yan-Pin; Tzeng, Ruoh-Ning; Chien, Yu-San; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Low Temperature (< 180 degrees C) Wafer-level and Chip-level In-to-Cu and Cu-to-Cu Bonding for 3D IntegrationChien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-四月-2014Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D IntegrationChien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
2012Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS IntegrationsHu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Multi-Layer Adaptive Power Management Architecture for TSV 3DIC ApplicationsChang, Ming-Hung; Hsieh, Wei-Chih; Wu, Pei-Chen; Chuang, Ching-Te; Chen, Kuan-Neng; Wang, Chen-Chao; Ting, Chun-Yen; Chen, Kua-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Near-/Sub-V-th Process, Voltage, and Temperature (PVT) Sensors with Dynamic Voltage SelectionChang, Ming-Hung; Lin, Shang-Yuan; Wu, Pei-Chen; Zakoretska, Olesya; Chuang, Ching-Te; Chen, Kuan-Neng; Wang, Chen-Chao; Chen, Kua-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2013Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D IntegrationHuang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
2014Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test VehicleLee, Shih-Wei; Shih, Jian-Yu; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2017Polymer-Based Liner TSV Fabrication Scheme and Its Resistance VariationLee, Shih-Wei; Shih, Jian-Yu; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2013Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing ApplicationsChang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
1-二月-2014A TSV-Based Bio-Signal Package With mu-Probe ArrayChou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-一月-2014A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe ArrayChou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
顯示 1 到 20 筆資料，總共 20 筆